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Magnetic tunnel junctions (MTJs) with low switching current, high thermal stability, and small device size are strongly preferred for low-power, high-reliability, and high-density spintronic memory and logic applications. The research of MTJs from shape in-plane magnetic anisotropy to interfacial perpendicular magnetic anisotropy (i-PMA) has successfully paved the way down to 20-nm scale, below which, however, the i-PMA approach reaches a physical limit in sustaining sufficient thermal stability while achieving low-power spin transfer torque switching. Recently, studies have been reported a new approach to pave the way toward sub-10-nm MTJs satisfying the requirements by revisiting shape perpendicular magnetic anisotropy (s-PMA). In this paper, we present a compact model of the sub-10-nm s-PMA MTJ device, which captures both the static and dynamic physical behaviors. This model is SPICE-compatible for hybrid MTJ/CMOS circuit designs. This paper is expected to push forward the development of sub-10-nm-scale MTJ-based spintronic memory and logic circuits. [ABSTRACT FROM AUTHOR]

The focus of this paper is to understand the impact of the material properties of GaN, exploited using a vertical device, in power switching by estimating switching loss. The study was performed with a cascoded current aperture vertical electron transistor (CAVET). The normally OFF device was simulated and analyzed using a Silvaco ATLAS 2-D drift diffusion model integrated to SPICE-based circuit simulator. Besides evaluating the performance space and, hence, potential application space for GaN CAVETs, this paper presents significant accomplishment in establishing a device to circuit model, thereby, offering a reliable method of evaluating GaN-based power transistors. The accuracy of the model was established through the excellent agreement of simulated data with the data sheet specs of a commercial cascoded GaN high electron mobility transistor. The model was successfully applied to compare SiC MOSFETs with GaN CAVETs. A cascoded GaN CAVET has $2\times $ faster switching time, $3\times $ lower switching loss compared with standard commercial SiC MOSFET, owing to the higher electron mobility in GaN. Operating at frequencies of megahertz with low power loss, a GaN CAVET will, therefore, lead to smaller converter size and higher system efficiency. [ABSTRACT FROM PUBLISHER]

Although spin transfer torque (STT)-based magnetic tunneling junction (MTJ) owns advantages of nonvolatility, nonlimited endurance, and fast write/read, its demand for high current density significantly casts a shadow over its future prospects. Recently, a novel three-terminal MTJ cell that combines voltage-controlled magnetic anisotropy (VCMA) effect and negative capacitance (NC) effect is proposed. Drawing support from the NC amplified VCMA effect and the three-step operation scenario, this novel MTJ cell can dramatically lower the energy consumption to fJ as well as keep high operation speed within nanoseconds. The feasibility of the proposed NC enhanced VCMA spintronics device for memory and logic application is proved by extensive physical simulation in our previous work. However, a SPICE compatible compact model of the proposed NC enhanced VCMA spintronics device is still demanded for circuit and system level evaluation. In this paper, we provide an accurate and fast compact model of NC enhanced VCMA device for both memory and logic applications. [ABSTRACT FROM AUTHOR]

In spite of the apparent simplicity of the system under study, compact modeling of complementary resistive switching (CRS) devices, i.e., two antiserially connected memristive structures, is by no means straightforward. This requires a deep understanding of the voltage drops occurring across the circuit elements and correct treatment of the so-called snapback (SB) effect typical of the breakdown process of a thin dielectric film in an MIS or a MIM structure. The SB effect fundamentally consists in a sudden reduction of the device resistance caused by the formation of a filamentary path spanning the insulator. Beyond this point, the filament widens keeping the voltage drop across its extremes constant. The consequence of disregarding this effect is clearly distinguishable in the simulated curves: progressive openings of the on-state windows for both positive and negative voltages instead of abrupt ones. In this paper, a modification is introduced in the original memdiode model for memristive devices in order to account for this remarkable feature. Ta2O5-based CRS devices are considered to demonstrate the suitability of our approach. [ABSTRACT FROM AUTHOR]

The accurate calculation of switching voltage (${V}_{s}$) is necessary for the reliable and low-power operation of monolithic 3-D (M3D) CMOS-nanoelectromechanical (NEM) hybrid reconfigurable logic circuits because ${V}_{s}$ corresponds to the operating voltage (${V}_{\text {dd}}$) of NEM memory switches. In this paper, based on the Euler–Bernoulli equation, the physics-based analytical model is proposed to determine ${V}_{s}$. The accuracy of the proposed model is verified by both the finite-element analysis and experimental results. Our proposed model shows >3% error compared with experimental data. Also, the design guidelines of NEM memory switches are presented in terms of minimum ${V}_{s}$ (${V}_{s\_{}{m}}$) and device dimensions. [ABSTRACT FROM AUTHOR]

Performance of the crossbar memory array highly depends on the selector characteristics. In this paper, rigorous transient analyses are performed for a large-size crossbar memory array using novel NbO2-based selectors with a threshold switching behavior. To enable accurate and efficient array-level simulation, an electrostatic discharge-based compact model is employed to effectively describe the ${I}$ – ${V}$ characteristics of the selector. Multiple key design parameters of the selector are investigated, such as the threshold voltage, leakage current, and intrinsic switching speed. A sensitivity analysis is performed to evaluate the impact of hypothetical improvements in various selector parameters. In addition, the impacts of resistances of interconnect and memory element on the array-level access delay and energy dissipation are quantified. The results show that reducing the threshold voltage of selectors provides the most significant performance improvement, where up to 80% of the energy-delay product saving is observed if the threshold voltage is reduced by 50%. [ABSTRACT FROM AUTHOR]

In this paper, we present an effective switching current model ( I\textsf {eff} ) for inverter followed by a transmission gate structure (Inv-Tx) based on its switching trajectory. Unlike an inverter or NAND/NOR gates, where I\textsf {eff} depends only on nMOSFET (pMOSFET) current for a falling (rising) transition, it is a function of both nMOSFET and pMOSFET currents for an Inv-Tx cell. The proposed model is verified against HSPICE simulations for a wide range of supply voltages and fan-outs at different technology nodes (e.g., 180, 130, and 65 nm). The model predicts the transition delay values with an average (maximum) error of 7% (11%) compared with HSPICE simulations. Synopsys TCAD Sentaurus simulations at 32-nm technology node are also used to validate the basic model assumptions. To demonstrate the utility of our model, design of some representative circuits while incorporating layout-dependent effects and inverse-narrow-width effect is presented. Finally, we show that a 256X1 multiplexer and a static D-flip-flop, with their transistor sizes and layout, optimized using the proposed model improves the performance of these circuits significantly over the conventional design methodologies. [ABSTRACT FROM PUBLISHER]

The aim of this paper is to introduce a compact model for perpendicular spin-transfer torque (STT)-magnetic tunnel junctions (MTJs) implemented in Verilog-A to assure easy integration with electrical circuit simulators. It takes into account the effects of voltage-dependent perpendicular magnetic anisotropy, temperature-dependent parameters, thermal heating/cooling, MTJ process variations, and the spin-torque asymmetry of the Slonczewski spin-polarization function in the switching process. This translates into a comprehensive modeling that was adopted to investigate the writing performance under voltage scaling of a $256\times256$ STT- magnetic random access memory array implemented at three different technology nodes. Obtained results show that scaling from 30- to 20-nm node allows a write energy saving of about 43%, while the supply voltage that assures the minimum-energy write operation increases. [ABSTRACT FROM PUBLISHER]

This paper presents a methodology to model GaN power HEMT switching transients. Thus, a compact model to predict devices’ pulse switching characteristics and current collapse reliability issue has been developed. Parasitic RC subcircuits and a standard double-pulse switching tester to model intrinsic parasitic effects and to analyze power dissipation of GaN power HEMT are proposed and presented. Switching transient including gate-lag and drain-lag is predicted for ideal (without trap) and nonideal (with trap) devices. The results are validated by and compared to 2-D finite-element technology computer-aided design simulations. The original aim of this exercise is to develop a fast (near-real-time) model which can predict dynamic behavior of single and multiple power GaN HEMTs used for the switching transients of GaN power devices at circuit level. [ABSTRACT FROM PUBLISHER]

3-D integrations are unavoidable task for new emerging memories, including resistive switching random-access memory (RRAM), in order to overcome the market-leading nand flash. However, an RRAM crossbar array (CBA) suffers severe read margin degradation due to the sneak current, which becomes even more critical as the memory density increases with the 3-D integration. In this paper, we extend the two-port readout scheme for a 2-D CBA, proposed in our previous work, to the 3-D vertical structure. A closed-form expression of the operating principle is derived, and HSPICE simulation using a $32\times 32\times8$ vertical RRAM CBA considering practical circuit parameters verifies feasibility of the two-port scheme to the 3-D CBA. [ABSTRACT FROM AUTHOR]

This paper analyzes write errors in spin-torque switching due to thermal fluctuations in a system with perpendicular magnetic anisotropy. Prior analytical and numerical methods are summarized; a physics-based general 2-D Fokker–Planck equation (FPE) is solved numerically. Due to its computational efficiency and broad applicability to all switching regimes and system symmetries, the 2-D FPE has been used to study the relation between write error slope and material parameters as well as some emerging switching schemes. [ABSTRACT FROM PUBLISHER]

Spin-transfer torque magnetic tunnel junction (MTJ) is a promising candidate for nonvolatile memories thanks to its high speed, low power, infinite endurance, and easy integration with CMOS circuits. However, a relatively high current flowing through an MTJ is always required by most of the switching mechanisms, which results in a high electric field in the MTJ and a significant self-heating effect. This may lead to the dielectric breakdown of the ultrathin ( $\sim 1$ nm) oxide barrier in the MTJ and cause functional errors of hybrid CMOS/MTJ circuits. This paper analyzes the physical mechanisms of time-dependent dielectric breakdown (TDDB) in an oxide barrier and proposes an SPICE-compact model of the MTJ. The simulation results show great consistency with the experimental measurements. This model can be used to execute a more realistic design according to the constraints obtained from simulation. The users can estimate the lifetime, the operation voltage margin, and the failure probability caused by TDDB in the MTJ-based circuits. [ABSTRACT FROM AUTHOR]

A model of resistive random access memory (RRAM) cells aimed at providing an optimal programming/erase scheme in which the timing and biasing can be accurately optimized is proposed and implemented. To expedite technology development with an emphasis on ICs, a predictive model to capture the physical operation of every memory cell is needed. Although a number of compact RRAM models have been developed, this paper further considers the time-dependent reset process and the heat transfer in the conductive filaments. These phenomena are becoming critical in scaled memory cells and need to be carefully addressed. Due to the physical nature of the model, model parameters can be straightforwardly calibrated, relying on limited measurement data. The compact model is implemented using Verilog-A, and it is flexible for different circuit simulators. [ABSTRACT FROM PUBLISHER]

The current-induced perpendicular magnetic anisotropy magnetic tunnel junctions (p-MTJs) offer a number of advantages, such as high density and high speed. As p-MTJs downscale to $\sim 40$ nm, further performance enhancements can be realized thanks to high spin-torque efficiency, i.e., lower critical current density and higher thermal stability. In this paper, we investigate the origin of high spin-torque efficiency and give a phenomenological theory to describe the critical current reduction due to the subvolume activation. Based on various physical theories and structural parameters, a compact model of nanoscale MTJ is developed and demonstrates a satisfactory agreement with experimental results. Dynamic, static, and stochastic switching behaviors have been addressed and validated. Then, we perform mixed simulations for hybrid MTJ/CMOS read/write circuits, magnetic random access memory, and magnetic flip-flop to evaluate their performance. Analyses of energy consumption are given to show the prospect of MTJ technology node miniaturization. [ABSTRACT FROM AUTHOR]

This paper reports on modeling and analysis of power delivery network (PDN) impedance and switching noise in through silicon via (TSV)-based 3-D integration. PDN is simulated in SPICE with the combination of lumped-element models and distributed-element models, where the elements are extracted from full-wave electromagnetic modeling. PDN impedance explicitly distinguishes the contributions from off-chip PDN and on-chip PDN, and reveals the TSV-induced resonant effect associated with the 3-D chip stack. The simultaneously switching noises in PDN are simulated and analyzed in different frequency regions, in which 3-D integration has distinct impacts on the PDN impedance. [ABSTRACT FROM AUTHOR]

The nonlinear junction capacitances of power devices are critical for the switching transient, which should be fully considered in the modeling and transient analysis, especially for high-frequency applications. The silicon carbide (SiC) MOSFET combined with SiC Schottky Barrier Diode (SBD) is recognized as the proposed choice for high-power and high-frequency converters. However, in the existing SiC MOSFET models only the nonlinearity of gate-drain capacitance is considered meticulously, but the drain–source capacitance, which affects the switching commutation process significantly, is generally regarded as constant. In addition, the nonlinearity of diode junction capacitance is neglected in some simplified analysis. Experiments show that without full consideration of nonlinear junction capacitances, some significant deviations between simulated and measured results will emerge in the switching waveforms. In this paper, the nonlinear characteristics of drain–source capacitance in SiC MOSFET are studied in detail, and the simplified modeling methods for engineering applications are presented. On this basis, the SiC MOSFET model is improved and the simulation results with improved model correspond with the measured results much better than before, which verify the analysis and modeling. [ABSTRACT FROM AUTHOR]

Resistive switching memory (RRAM) relies on the voltage-driven formation/disruption of a conductive filament (CF) across a thin insulating layer. Due to the 1-D structure of the CF and discrete nature of defects, the set and reset states of the memory device generally display statistical variability from cycle to cycle. For projecting cell downscaling and designing improved programming operations, the variability as a function of the operation parameters, such as the maximum current in the set process and maximum voltage in the reset process, need to be evaluated and understood. This paper addresses set/reset variability, presenting statistical data for HfOx-based RRAM and introducing a physics-based Monte Carlo model for switching statistics. The model can predict the distribution of the set state as a function of the compliance (maximum) current during set and distribution of the reset state as a function of the stop (maximum) voltage during reset. Numerical modeling results are finally presented to provide additional insight into discrete fluctuation events. [ABSTRACT FROM AUTHOR]

Emerging nonvolatile memories based on resistive switching mechanisms pull intense research and development efforts from both academia and industry. Oxide-based resistive random access memories (OxRAM) gather noteworthy performances, such as fast WRITE/READ speed, low power, high endurance, and large integration density that outperform conventional flash memories. To fully explore new design concepts, such as distributed memory in logic or biomimetic architectures, robust OxRAM compact models must be developed and implemented into electrical simulators to assess performances at a circuit level. In this paper, we propose a physics-based compact model used in electrical simulator for bipolar OxRAM memories. After uncovering the theoretical background and the set of relevant physical parameters, this model is confronted to experimental electrical data. The excellent agreement with these data suggests that this model can be confidently implemented into circuit simulators for design purpose. [ABSTRACT FROM PUBLISHER]

The resistive random access memory (RRAM) crossbar array has been extensively studied as one of the most promising candidates for future high-density nonvolatile memory technology. However, some problems caused by circuit and device interaction, such as sneak leakage paths, result in limited array size and large power consumption, which degrade the array performance significantly. Thus, the analysis on circuit and device interaction issue is imperative. In this paper, a simulation method is developed to investigate the critical issues correlated with the interaction between devices and the circuit. The simulations show that a large off/on ratio of resistance states of RRAM is beneficial for large readout margin (i.e., array size). The existence of the selector connected in series with an RRAM device can eliminate the need for high Ron resistance, which is critical for the array consisted of only RRAM cells. The readout margin is more sensitive to the variation of Ron and is determined by the nonlinearity of the I–V characteristics of RRAM, whereas the nonlinear characteristics of the selector device are beneficial for a larger readout margin. An optimal design scheme for turn-on voltage and conductance of the selector is proposed based on the simulation. [ABSTRACT FROM PUBLISHER]

This paper describes the application of electrical circuit simulations in intelligent power module development for hybrid vehicles, electric vehicles, and fuel cell vehicles. The limitations of the conventional design and simulation systems are discussed, and efforts for overcoming these limitations are described. The introduction of a physics-based insulated-gate-bipolar-transistor model with a surface-potential MOSFET core into the design flow is described. Finally, future expectations for necessary simulation technology development are given. [ABSTRACT FROM PUBLISHER]

Magnetic tunnel junctions (MTJs) composed of ferromagnetic layers with perpendicular magnetic anisotropy (PMA) are of great interest for achieving high-density nonvolatile memory and logic chips owing to its scalability potential together with high thermal stability. Recent progress has demonstrated a capacity for high-speed performance and low power consumption through current-induced magnetization switching. In this paper, we present a compact model of the CoFeB/MgO PMA MTJ, a system exhibiting the best tunnel magnetoresistance ratio and switching performance. It integrates the physical models of static, dynamic, and stochastic behaviors; many experimental parameters are directly included to improve the agreement of simulation with experimental measurements. Mixed simulation based on the 65-nm technology node of a magnetic flip-flop validates its relevance and efficiency for MTJ/CMOS memory and logic chip design. [ABSTRACT FROM AUTHOR]

The need for reliable models that take into account the nonlinear kinetics of dopants is nowadays of paramount importance, particularly with the physical dimensions of electron devices shrinking to the deep nanoscale range and the development of emerging nanoionic systems such as the memristor. In this paper, we present a novel nonlinear dopant drift model that resolves the boundary issues existing in previously reported models that can be easily adjusted to match the dynamics of distinct memristive elements. With the aid of this model, we examine switching mechanisms, current–voltage characteristics, and the collective ion transport in two terminal memristive devices, providing new insights on memristive behavior. [ABSTRACT FROM PUBLISHER]

The transient simulation of threshold switching in phase-change memory (PCM) devices is essential for the prediction and optimization of cell behavior depending on the circuit parameters and for the understanding of the ultimate limit of operation speed. This paper presents a simulation study of threshold switching in PCM devices aimed at investigating the role of delay and switching times in cell behavior. The analytical Poole–Frenkel model for conduction and the energy gain model for threshold switching are used to evaluate the transient effects. The current and field transients at the basis of the switching phenomenon are shown and discussed with the aid of the numerical model. The impact of cell parasitics, in particular the parallel capacitance, is finally addressed. [ABSTRACT FROM PUBLISHER]