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This paper presents the application of compact insulated gate bipolar transistor and p-i-n diode models, including features such as local lifetime control and field-stop technology, to the full electrothermal system simulation of a hybrid electric vehicle converter using a lookup table of device losses. The vehicle converter is simulated with an urban driving cycle (the Federal Urban Driving Schedule), which is used to generate transient device temperature profiles. A methodology is also described to explore the converter reliability using the temperature profile, with rainflow cycle counting techniques from material fatigue analysis. The effects of ambient temperature, driving style, and converter design on converter reliability are also investigated. Index Terms--Compact modeling, electrothermal simulation, mission profile, power semiconductor devices, rainflow cycle counting, reliability, thermal cycling.

Although insulated-gate bipolar-transistor (IGBT) turn-on losses can be comparable to turn-off losses, IGBT turn-on has not been as thoroughly studied in the literature. In the present work IGBT turn on under resistive and inductive load conditions is studied in detail through experiments, finite element simulations, and circuit simulations using physics-based semiconductor models. Under resistive load conditions, it is critical to accurately model the conductivity-modulation phenomenon. Under clamped inductive load conditions at turn-on there is strong interaction between the IGBT and the freewheeling diode undergoing reverse recovery. Physics-based IGBT and diode models are used that have been proved accurate in the simulation of IGBT turn-off. Index Terms--Compact semiconductor device models, insulated-gate bipolar-transistor (IGBT) turn-on, interaction, physics-based semiconductor modeling.

This paper presents the development and implementation of a physics-based diode model which can simulate aspects of high-voltage diodes such as snappy recovery during punch-through and the modified carrier density profile due to local lifetime control. It uses a Fourier series solution for the ambipolar diffusion equation in the lightly doped base region. The model is compared with finite-element device simulations. A parameter extraction procedure for the diode with lifetime control is proposed in Part II. Index Terms--Lifetime control, physics-based model, p-i-n diode model, power semiconductor modeling, variable lifetime.

In this paper, a parameter extraction procedure for high-voltage diodes with local lifetime control is proposed. It is designed for use with the physics-based diode model described in Part I, which is capable of simulating diodes with local lifetime control. The parameter extraction procedure described requires a forward characteristic and a reverse recovery measurement. The parameter extraction procedure is illustrated using finite-element simulations. The physics-based model using the parameters extracted is then compared with experimental results. Index Terms--Lifetime control, physics-based model, p-i-n diode model, power semiconductor modeling, variable lifetime.

Recently, a simulation method for power electronic devices has emerged, which has high accuracy and short run times based on a Fourier model of the device physics. This paper describes the use of the Fourier models for diodes and insulated gate bipolar transistors (IGBTs) and implementation in MATLAB and Simulink in a formal optimization strategy. In particular, this paper investigates coupled circuit, diode, and IGBT behavior. Conclusions are drawn concerning device loading and circuit design, particularly the role of stray inductance. Index Terms--Circuit modeling, diode, insulated gate bipolar transistor (IGBT), MATLAB, optimization, physics-based semiconductor device models, power semiconductor modeling, simulation, Simulink.

A practical and accurate parameter extraction method is presented for the Fourier-based-solution physics-based insulated gate bipolar transistor (IGBT) and power diode models. The goal is to obtain a model accurate enough to allow switching loss prediction under a variety of operating conditions. In the first step of the extraction procedure, only one simple clamped inductive load test is needed for the extraction of the six parameters required for the diode model and of the 12 and 15 parameters required for the nonpunch-through (NPT) and punch-through (PT) IGBT models, respectively. The second part of the extraction procedure is an automated formal optimization step that refines the parameter estimation. Validation with experimental results from various structures of IGBT demonstrates the accuracy of the proposed IGBT and diode models and the robustness of the parameter extraction method. Index Terms--Insulated gate bipolar transistor (IGBT) model, optimized parameter extraction, parameter extraction, power diode model, semiconductor modeling.

The switching characteristics (turn-on and turn-off) and forward conduction drop of trench-gate punch-through insulated gate bipolar transistors (IGBTs) are examined over a temperature range of from -50[degrees]C to 125[degrees]C. An analytical description of the forward conduction voltage drop is presented based on temperature dependencies of the appropriate physical parameters and mechanisms. A physics-based PSpice model, incorporating much of the device behavior, is also described. Results from the model are compared to experimental waveforms. Index Terms--Electrothermal semiconductor models, insulated gate bipolar transistor (IGBT), physics-based power semiconductor models, power semiconductor modeling, punch-through (PT) IGBT.

The problems faced in generating analytical models for the insulated gate bipolar transistor (IGBT) and power diode are devising correct equations and determining realistic boundary conditions, especially for two-dimensional (2-D) features, while ensuring convergence of the models. These issues are addressed in this paper in relation to the temperature dependent modeling of NPT IGBTs and diodes. Simulation and experimental results are presented and compared to validate the modeling approach. Index Terms--IGBT, physics-based semiconductor device models, power diode, quasi-2-D semiconductor device models.

The high-voltage field-stop (FS) insulated gate bipolar transistor (IGBT) is a promising power device for high-power applications thanks to the robust characteristics offered by the FS technology, which combines the inherent advantages offered by punch-through and nonpunch-through structures while overcoming the drawbacks of each structure. in this paper, an electrothermal physics-based model for the FS IGBT is developed. The model contains a detailed description of the FS layer and it is validated using experimental results for a commercial 1200-V/60-A FS IGBT over the entire temperature range specified in the data sheets. The validated model is then used to simulate a 6.5-kV FS IGBT. The simulation results are compared with experimental results published in the literature and good agreement is obtained. Index Terms--Field-stop insulated gate bipolar transistor (FS IGBT), high voltage IGBT, physics-based power semiconductor models, power semiconductors modeling.

An advantage for some wide bandgap materials, that is often overlooked, is that the thermal coefficient of expansion (CTE) is better matched to the ceramics in use for packaging technology. It is shown that the optimal choice for uni-polar devices is clearly GaN. It is further shown that the future optimal choice for bipolar devices is C (diamond) owing to the large bandgap, high thermal conductivity, and large electron and hole mobilities. A new expression relating the critical electric field for breakdown in abrupt junctions to the material bandgap energy is derived and is further used to derive new expressions for specific on-resistance in power semiconductor devices. These new expressions are compared to the previous literature and the efficacy of specific power devices, such as heterojunction MOSFETs, using GaN are discussed. Index Terms--Breakdown voltage, critical electric field, diamond, GaN, power electronics, SiC, specific on-resistance, wide bandgap.

This paper presents a unified physics-based insulated-gate bipolar transistor (IGBT) compact model for circuit simulation that predicts the performance of both Si and SiC, n- and p-channel devices. The model can predict the detailed switching waveforms of these technologies based on its charge-based formulation. Further, this compact IGBT model is presented alongside a unique datasheet-driven parameter extraction process. The parameter extraction process enables users to quickly extract model parameters from data typically published without the need of taking physical measurements. The model has been validated with both Si and SiC devices for static and dynamic characteristics. The SiC IGBTs used for validation are a 12.5-kV n-channel device and a 13-kV p-channel device, while the Si IGBT chosen was IXDH30N120 from IXYS Corp. (Milpitas, CA, USA). This is the only IGBT model that predicts the performance of both n- and p-channel, Si and SiC devices, providing more freedom for the development of complex power electronics circuit designs. The convergence of the model has been verified by implementing a complex circuit consisting of both a dc–dc converter and a dc–ac inverter. The results presented here show that the unified model can be used to describe the behavior of a wide range of Si and SiC IGBT circuits. This paper is accompanied by a Verilog-A source code and a power point file demonstrating the model parameter extraction sequence. [ABSTRACT FROM AUTHOR]

Fault diagnosis of the bearings in direct-drive (i.e., no gearbox) wind turbines is a challenging issue due to the varying shaft rotating frequency (SRF) caused by the erratic wind environment. To remove the spectrum smearing phenomena of the SRF-related components and the disturbances of the SRF-unrelated components in a measured signal, this paper proposes a novel method, called multiscale filtering spectrum (MFS), to obtain the weighted energy distribution of the monocomponent signals within a local order range based on the Vold-Kalman filter (VKF). First, the instantaneous SRF of the wind turbine is estimated from a generator current signal. Then, a VKF-based multiscale filter bank is designed according to the center frequencies corresponding to the SRF at different scales. The monocomponent signals whose frequencies are continuous multipliers of the SRF are subsequently extracted from the envelope of the measured current or vibration signal. Finally, a weighted energy spectrum is constructed within the selected order range, from which possible bearing fault characteristic orders can be identified. Simulation and experiment results show that the proposed new MFS method can enhance the characteristic orders and suppress the noise, and therefore has better performance than the traditional angular resampling method for bearing fault diagnosis of direct-drive wind turbines under varying speed conditions. [ABSTRACT FROM PUBLISHER]

A resistance-capacitance (RC) thermal network with temperature-dependent thermal conductivities and heat capacitances is used to calculate the junction temperature of insulated-gate bipolar-transistor modules using a device model realized in Simulink. The collector current I_{C}, collector–emitter voltage V_{CE}, and the case temperature TC measured during the cycling are used as input parameters of the proposed model. The proposed model is easier to implement compared with the thermosensitive electrical parameter (TSEP) method, and it is compared with an RC network with constant thermal conductivity and heat capacitance model and experimentally verified by using a TSEP method. The results of the proposed model show an improvement of the accuracy for determining the junction temperature compared with the model with constant thermal conductivity and heat capacitance. [ABSTRACT FROM PUBLISHER]

Compact models of wide-bandgap power devices are necessary to analyze and evaluate their impact on circuit and system performance. Part I reviewed compact models for silicon carbide (SiC) power diodes and MOSFETs. Part II completes the review of SiC devices and covers gallium nitride devices as well. [ABSTRACT FROM AUTHOR]

Wide bandgap power devices have emerged as an often superior alternative power switch technology for many power electronic applications. These devices theoretically have excellent material properties enabling power device operation at higher switching frequencies and higher temperatures compared with conventional silicon devices. However, material defects can dominate device behavior, particularly over time, and this should be strongly considered when trying to model actual characteristics of currently available devices. Compact models of wide bandgap power devices are necessary to analyze and evaluate their impact on circuit and system performance. Available compact models, i.e., models compatible with circuit-level simulators, are reviewed. In particular, this paper presents a review of compact models for silicon carbide power diodes and MOSFETs. [ABSTRACT FROM AUTHOR]

A practical parameter extraction procedure for a power silicon carbide (SiC) junction field-effect transistor (JFET) is presented. The carrier mobility and carrier concentration are very important parameters, strongly affecting the device current capability and dynamic characteristics for a given design. When modeling JFETs, the values of these parameters are usually based on assumptions and given by a vendor in a range. As a result, model accuracy is compromised. In this paper, a step-by-step parameter extraction procedure is described that includes the extraction of mobility and carrier concentration in the channel and drift regions based on knowledge of device geometrical parameters. For the first time, carrier mobilities in the channel and drift regions of a power JFET are extracted individually. It is found that channel and drift region mobilities can be very different for a given device since they are strongly dependent on the fabrication process. The separate extraction of these two mobilities can also improve model accuracy in the case of imperfect knowledge of the device geometry. The developed procedure includes the extraction of empirical parameters describing the temperature dependence of mobilities in the channel and drift regions. A simple static I– V characterization and C–V measurements are the only measurements required for the parameter extraction. In this paper, the procedure is experimentally validated for both normally off (enhancement mode) and normally on (depletion mode) JFETs. [ABSTRACT FROM AUTHOR]