130 results on '"Chien, Wei-Ting Kary"'
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2. Exploration of baking temperature effects on 28 nm BEOL reliability
3. Early detection and prediction of HKMG SRAM HTOL performance by WLR PBTI tests
4. Influence of I/O oxide process on the NBTI performance of 28 nm HfO2-based HKMG p-MOSFETs
5. Parametric Approaches To Decide Optimal System Burn-in Time
6. Basic Reliability Concept
7. Reliability Stress Tests
8. Yield and Modeling Yield
9. Integrating Reliability into Microelectronics Manufacturing
10. Nonparametric Approach and Its Applications to Burn-in
11. Nonparametric Reliability Analysis
12. Burn-in Performance, Cost, and Statistical Analysis
13. The Dirichlet Process for Reliability Analysis
14. Overview of Design, Manufacture, and Reliability
15. Nonparametric Bayesian Approach for Optimal Burn-in
16. Software Reliability and Infant Mortality Period of the Bathtub Curve
17. A cost-effective wafer-level reliability test system for integrated circuit makers
18. Practical 'Building-in Reliability' approaches for semiconductor manufacturing
19. Some practical concerns on isothermal electromigration tests
20. An Extended Building-In Reliability Methodology on Evaluating SRAM Reliability by Wafer-Level Reliability Systems
21. A Study On The Dielectric Intrinsic Breakdown Specification
22. A nonparametric approach to estimate system burn-in time
23. Some practical considerations for effective and efficient wafer-level reliability control
24. Modeling & maximizing burn-in effectiveness
25. Reliability, Yield, and Stress Burn-In
26. Improvement of poly-silicon hole induced gate oxide failure by silicon rich oxidation
27. Determine optimal burn-in time for highly integrated circuit systems
28. AdaBalGAN: An Improved Generative Adversarial Network With Imbalanced Learning for Wafer Defective Pattern Recognition
29. Fast Semiconductor Reliability Assessments Using SPRT
30. The Competing Aging Effects on SRAM Operating Life Tests
31. Statistical Process Control for Monitoring the Particles With Excess Zero Counts in Semiconductor Manufacturing
32. Use of the dirichlet process for reliability analysis
33. The applications of FIB 3-point localization method in semiconductor failure analyses
34. Advanced delayer methods for TEM sample preparations
35. A study for big-data (Hadoop) application in semiconductor manufacturing
36. A method to group reliability data by hierarchical clustering
37. Influence of I/O oxide process on the NBTI performance of 28nm HfO2-based HKMG p-MOSFETs
38. Performance enhancement of ILD by reducing residues during contact W CMP
39. Reliability improvement based on silicon nitride MIM capacitors for mixed-signal and RF applications
40. Resolving plasma induced damage for a CMOS embedded-OTP technology
41. Wafer level package wafer probing shift error-proof quality control
42. The investigation of semiconductor shipping bag reliability
43. Electromigration Lifetime Optimization by Uniform Designs and a New Lifetime Index
44. Comprehensive Wafer Level Package Die Processing Service quality control enhancement
45. The reversed intrinsic curve and voltage dependence for ultra-low k dielectrics
46. Reliability Baseline Management and Applications in Semiconductor Manufacturing
47. Board level reliability enhancements for wafer level package
48. Ultra low-K CPI evaluations for foundry backend and assembly saw processes
49. Employing optimal experimental design to optimize the accelerated life test plan for TDDB
50. Early detection for quality and reliability management
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