44 results on '"Chien, Wei-Ting Kary"'
Search Results
2. Exploration of baking temperature effects on 28 nm BEOL reliability
3. Early detection and prediction of HKMG SRAM HTOL performance by WLR PBTI tests
4. Influence of I/O oxide process on the NBTI performance of 28 nm HfO2-based HKMG p-MOSFETs
5. A cost-effective wafer-level reliability test system for integrated circuit makers
6. Practical 'Building-in Reliability' approaches for semiconductor manufacturing
7. Some practical concerns on isothermal electromigration tests
8. A nonparametric approach to estimate system burn-in time
9. Some practical considerations for effective and efficient wafer-level reliability control
10. Modeling & maximizing burn-in effectiveness
11. Improvement of poly-silicon hole induced gate oxide failure by silicon rich oxidation
12. An Extended Building-In Reliability Methodology on Evaluating SRAM Reliability by Wafer-Level Reliability Systems.
13. AdaBalGAN: An Improved Generative Adversarial Network With Imbalanced Learning for Wafer Defective Pattern Recognition.
14. Fast Semiconductor Reliability Assessments Using SPRT.
15. The Competing Aging Effects on SRAM Operating Life Tests.
16. Statistical Process Control for Monitoring the Particles With Excess Zero Counts in Semiconductor Manufacturing.
17. A study for big-data (Hadoop) application in semiconductor manufacturing.
18. A method to group reliability data by hierarchical clustering.
19. Early detection for quality and reliability management.
20. Employing optimal experimental design to optimize the accelerated life test plan for TDDB.
21. Ultra low-K CPI evaluations for foundry backend and assembly saw processes.
22. Board level reliability enhancements for wafer level package.
23. Gate oxide reliability improvement for UMOS technology.
24. An investigation on the high temperature dependence of the HCI on NMOSFET transistor.
25. Sample preparation DOE for the die pull test.
26. Comprehensive Wafer Level Package Die Processing Service quality control enhancement.
27. Wafer level package wafer probing shift error-proof quality control.
28. The investigation of semiconductor shipping bag reliability.
29. Electromigration Lifetime Optimization by Uniform Designs and a New Lifetime Index.
30. Reliability Baseline Management and Applications in Semiconductor Manufacturing.
31. An enhancement for single sampling plan method.
32. A study on the statistical comparison methods for engineering applications.
33. A study on the relationship between pad surface fluorine concentration and the formation of pad corrosion defect.
34. A sample preparation technique to reveal the implant profile by TEM for IC failure analysis.
35. Reliability improvement based on silicon nitride MIM capacitors for mixed-signal and RF applications.
36. Performance enhancement of ILD by reducing residues during contact W CMP.
37. Resolving plasma induced damage for a CMOS embedded-OTP technology.
38. Sample preparation and improvement for Die Pull test.
39. Editorial: Reduce Time-to-Market by Considering Reliability Tradeoffs.
40. USING REVERSE ARRANGEMENT TEST TO DETECT NON-MONOTONIC TRENDS FOR SEMICONDUCTOR MANUFACTURING AND RELIABILITY TESTS.
41. A New Method to Determine the Reliability Comparability for Products, Components, and Systems in Reliability Testing.
42. A nonparametric Bayes approach to decide system burn-in time.
43. The reversed intrinsic curve and voltage dependence for ultra-low k dielectrics.
44. Early failure model analysis and improvement of the upstream electromigration in 45nm Cu low-k interconnects.
Catalog
Books, media, physical & digital resources
Discovery Service for Jio Institute Digital Library
For full access to our library's resources, please sign in.