1. Impact of Non-Uniform Doping on the Reliability of Double Gate JunctionLess Transistor: A Numerical Investigation.
- Author
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Kumari, Vandana, Gupta, Mridula, and Saxena, Manoj
- Subjects
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STRAY currents , *LOW temperatures , *HIGH temperatures , *TRANSISTORS , *TUNNEL design & construction , *METAL oxide semiconductor field-effect transistors - Abstract
This paper systematically studies the reliability of non-uniformly doped Double Gate Junctionless transistor using ATLAS TCAD simulation. The reliability analysis is mainly based on the understanding of Band-To-Band-Tunneling (BTBT) current, lattice temperature, drain conductance and gate leakage current. Presented results show that higher source/drain work-function is beneficial in reducing tunneling current (1 × 10−9 A to 4 × 10−11 A @ Vgs = −1 V) but eventually it will also degrade electrostatic current significantly (∼3 order). Source/Drain length has also been varied during optimization and it has been observed that, shorter source drain extension region degrades the device reliability (i.e. higher magnitude of tunneling current (7 × 10−9 A @ Vgs =−1 V for LS = LD = 5 nm)). Different doping profile considered for performance assessment are: uniform, step (i.e. low–low–high and high–high–low etc.) and different configurations of gaussian doping profile. Minimum variation in tunneling current with negative gate bias, i.e. ∼ 1 order has been seen from the device having uniform doping 1019 cm−3 but at the cost of significantly high off-state current (2 × 10−9 A @ Vgs = 0 V) and tunneling current (2 × 10−8 A @ Vgs = −1 V). Thus, instead of using uniform doping, step type profile (i.e. Case A) is the better choice which results in lower tunneling current (1 × 10−9 A @ Vgs = −1 V), moderate lattice temperature (326) and better Ion/Ioff ratio (243 × 108). Device lattice temperature has also been controlled by using step A doping profile even at the higher operating temperatures due to lower Self Heating Effect. [ABSTRACT FROM AUTHOR]
- Published
- 2022
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