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Thermally stimulated current (TSC) spectroscopy and high-voltage back-gating measurement are utilized to study GaN buffer traps specific to AlGaN/GaN lateral heterojunction structures grown on a low-resistivity Si substrate. Three dominating deep-level traps in GaN buffer with activation energies of ΔET1~0.54 eV, ΔET2~0.65 eV, and ΔET3~0.75 eV are extracted from TSC spectroscopy in a vertical GaN-on-Si structure. High back-gate bias applied to the Si substrate could influence the drain current in an AlGaN/GaN-on-Si high-electron-mobility transistor in a way that cannot be explained with a simple field-effect model. By correlating the trap states identified in TSC with the back-gating measurement results, it is proposed that the ionization/deionization of both donor and acceptor traps are responsible for the generation of buffer space charges, which impose additional modulation to the 2DEG channel. [ABSTRACT FROM AUTHOR]

Highlights: [•] Propose nonalloyed Schottky-Source/Drain technology enabling a gate-first InAlN/GaN HEMTs. [•] The Schottky source can reduce source carrier injection and subthreshold leakage. [•] The gate-first InAlN/GaN HEMTs achieves 229% improvement in breakdown voltage. [•] The Schottky-Source/Drain technology is beneficial to device downscaling. [•] This gate-first InAlN/GaN HEMTs show great promise for self-aligned HEMTs. [ABSTRACT FROM AUTHOR]

The threshold voltage ( VT) instability of metal-insulator-semiconductor high electron mobility transistors (MIS-HEMTs) is investigated. In the enhancement-mode AlGaN/GaN MIS-HEMT fabricated by fluorine plasma implantation technique featuring Al2O3 gate dielectric, a hysteresis of 0.6 V in transfer characteristics is observed by quasi-static I - V (current-voltage) measurement, in which the gate bias is swept at a low rate (0.7 V/s). Pulsed transfer characteristics measurement, however, unveils much larger hysteresis under the same gate voltage swing. The VT-instability is attributed to the traps located at the dielectric/III-nitride interface as well as in the bulk of gate dielectric. It is proposed that pulsed measurement can count for the effect of fast traps (shallow traps) while the quasi-static measurement can only reflect slow traps (deep traps), and is more accurate for VT-instability evaluation. In addition, the existence of bulk traps is implied by a slow time-dependent shift of VT under large gate bias. (© 2013 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim) [ABSTRACT FROM AUTHOR]

In this paper, we investigate the enhancement-mode (E-mode) LaLuO3 (LLO)-AlGaN/GaN metal-insulator-semiconductor high-electron mobility transistors (MIS-HEMTs) fabricated using fluorine (F) plasma ion implantation with a gate-dielectric-first planar process. The E-mode MIS-HEMTs exhibit a threshold voltage (VTH) of 0.6 V, a peak transconductance of \sim193~mS/mm, a small hysteresis of 0.04 V in linear region characterized by a pulse-mode current-voltage measurement, and significantly suppressed current collapse under high-drain-bias switching conditions. X-ray photoelectron spectroscopy and secondary ion mass spectrometry analyses manifest that the negatively charged F ions penetrating into the (Al)GaN barrier layer serve as the primary VTH modulation mechanism, whereas the F ions in the fluorinated LLO film form chemical bonds with La/Lu atoms and become charge-neutral. The suppressed current collapse is verified as an advantageous byproduct of the F plasma ion implantation that also fluorinated the SiNx sidewalls in the vicinity of the gate electrode, and therefore, suppress electron injection to the gate-drain access region. [ABSTRACT FROM AUTHOR]

In this paper, we demonstrate a 253% improvement in the off-state breakdown voltage (BV) of the lattice-matched \In0.17\Al0.83 \N/GaN high-electron-mobility transistors (HEMTs) by using a new Schottky-contact technology. Based on this concept, the Schottky-source/drain and Schottky-source (SS) InAlN/GaN HEMTs are proposed. The proposed InAlN/GaN HEMTs with an LGD of 15 \mu\m showed a three-terminal BV of more than 600 V, while the conventional InAlN/GaN HEMTs of the same geometry showed a maximum BV of 184 V. Without using any field plate, the BV of 650 V was measured in the SS InAlN/GaN HEMTs with LGD = \15\ \mu\m, which is the highest BV ever achieved on InAlN/GaN HEMT. The corresponding specific on-resistance (Rsp, on) is as low as 3.4 \m\Omega \cdot \cm^2. A BV of 118 V was also obtained in SS InAlN/GaN HEMTs with LGD = \1\ \mu\m, which is the highest BV in GaN-based HEMTs featuring such a short LGD with GaN buffer. The improvement of the BV relies on the effective suppression of source carrier injection into the GaN buffer under the SS due to the smooth metal morphology and elimination of metal spikes in the Schottky metallization. [ABSTRACT FROM AUTHOR]

Dielectrophoresis (DEP) induced by activating a patterned two-dimensional electron gas (2DEG) at the interface of compound semiconductor AlGaN/GaN heterojunction has been demonstrated for the first time in our previous work. Briefly, with a peak voltage of ±10 V and a frequency from 100 kHz to 1 MHz, characteristics of both positive and negative DEP have been observed successfully manipulating 2 µm polystyrene microspheres in a drop of deionized (DI) water (pH ∼ 7 and conductivity 1 × 10−4 S m−1) over castellated 2DEG electrodes separated by critical dimensions 50 and 150 µm. This study reports a peculiar observation encountered when performing the DEP experiments under ultraviolet (UV) radiation: The microspheres have been repelled from the 2DEG electrodes yet remained on the surface during pDEP and then levitated upon switching to nDEP. This behavior is not observed in DEP with conventional microelectrodes and explained here by the UV-induced electron-hole generation and the subsequent charge redistribution in the AlGaN/GaN heterostructure. [ABSTRACT FROM AUTHOR]

Iron(Fe)-doped InN (InN:Fe) layers have been grown by molecular beam epitaxy. It is found that Fe-doping leads to drastic increase of residual electron concentration, which is different from the semi-insulating property of Fe-doped GaN. However, this heavy n-type doping cannot be fully explained by doped Fe-concentration ([Fe]). Further analysis shows that more unintentionally doped impurities such as hydrogen and oxygen are incorporated with increasing [Fe] and the surface is degraded with high density pits, which probably are the main reasons for electron generation and mobility reduction. Photoluminescence of InN is gradually quenched by Fe-doping. This work shows that Fe-doping is one of good choices to control electron density in InN. [ABSTRACT FROM AUTHOR]

Abstract: In this report, we present a study on the exploitation of nanostructure-thin film interfaces. Here, the objective is to utilize such interfaces for developing nanostructures for advanced sensing devices, while using state-of-the-art microelectronic technology that enables batch production. In this context, growth of ZnO nanostructures on the GaN/AlGaN heterostructure layers was studied. A fabrication process, based on a hydrothermal growth method, was used for preparing the interfaces of nanostructured thin film. Samples were characterized by X-ray diffraction (XRD) and scanning electron microscopy (SEM) and obtained results suggested near epitaxial quality of the hetero-interface. Field-effect transistors (FETs) based on ZnO nanorods/GaN heterostructures were fabricated and tested in a controlled gas environment. Thus, it was demonstrated that nanostructures could be exploited in unconventional ways by employing them in scalable and batch-producible conventional semiconductor devices. [Copyright &y& Elsevier]

In this paper, a zero-bias mixer using a lateral field-effect diode fabricated on standard GaN-on-Si AlGaN/GaN high electron-mobility-transistor wafers is demonstrated. The diode features strong nonlinearity near zero bias, enabled by a threshold-voltage modulation using a fluorine-plasma-treatment technique. The maximum change in conductance was adjusted to ~0 V, leading to optimal conversion loss (CL) of the mixer at zero bias and eliminating the need for any dc supplies. The mixer is characterized from room temperature (RT) to 250 °C. At 2.5 GHz and at RT, the CL and third-order intermodulation intercept point are 12.9 dB and 17.64 dBm, respectively. The operation of the proposed diode is modeled by a physical equivalent circuit, wit the element values extracted from the measured S-parameters. The voltage-biasing dependence of the CL can be explained by a the model. The high-temperature operation of the mixer shows that the proposed mixer can perform well in high-temperature and ultralow-power applications. [ABSTRACT FROM AUTHOR]

High-Q copper inductors were fabricated on low-cost and low-loss bismaleimide triazine (BT) and glass substrate using electroplating process. A differential LC voltage-controlled oscillator (VCO) circuit was designed using these high-Q inductors at 2.4 GHz. Flip chip and multichip module (MCM) technologies were applied to assemble the active chips on BT and glass substrate. The inductors exhibited Q-factor as high as 25 at 2.4 GHz. VCOs with copper inductors on BT and glass substrate had phase noise of-108 dBc/Hz at 600 kHz offset for a 2.4-GHz carrier, which is 6-dB improvement compared with the one with on-chip Al inductors. There was almost no substrate loss for inductors on BT and glass substrates. The effect of fabrication defect and solder joint resistance were also investigated. This technique can be extended to other building blocks, thus realizing integration of the whole RF system. [ABSTRACT FROM AUTHOR]

We present the detailed dc and radio-frequency characteristics of an Al0.3Ga0.7N/GaN/In0.1Ga0.9N/GaN double-heterojunction HEMT (DH-HEMT) structure. This structure incorporates a thin (3 nm) In0.1Ga0.9N notch layer inserted at a location that is 6-nm away from the AlGaN/GaN heterointerface. The In0.1Ga0.9N layer provides a unique piezoelectric polarization field which results in a higher potential barrier at the backside of the two-dimensional electron gas channel, effectively improving the carrier confinement and then reducing the buffer leakage. Both depletion-mode (D-mode) and enhancement-mode (E-mode) devices were fabricated on this new structure. Compared with the baseline AlGaN/GaN HEMTs, the DH-HEMT shows lower drain leakage current. The gate leakage current is also found to be reduced, owing to an improved surface morphology in InGaN-incorporated epitaxial structures. DC and small- and large-signal microwave characteristics, together with the linearity performances, have been investigated. The channel transit delay time analysis also revealed that there was a minor channel in the InGaN layer in which the electrons exhibited a mobility slightly lower than the GaN channel. The E-mode DH-HEMTs were also fabricated using our recently developed CF4-based plasma treatment technique. The large-signal operation of the E-mode GaN-based HEMTs was reported for the first time. At 2 GHz, a 1 × 100 μm E-mode device demonstrated a maximum output power of 3.12 W/mm and a power-added efficiency of 49% with single-polarity biases (a gate bias of +0.5 V and a drain bias of 35 V). An output third-order interception point of 34.7 dBm was obtained in the E-mode HEMTs. [ABSTRACT FROM AUTHOR]

A low phase-noise X-band monolithic-microwave integrated-circuit voltage-controlled oscillator (VCO) based on a novel high-linearity and low-noise composite-channel A10.3 Ga0.7N/A10.05 Ga0.95 N/GaN high electron mobility transistor (HEMT) is presented. The HEMT has a 1 μm × 100 μm gate. A planar inter-digitated metal-semiconductor-metal varactor is used to tune the VCO's frequency. The polyimide dielectric layer is inserted between a metal and GaN buffer to improve the Q factor of spiral inductors. The VCO exhibits a frequency tuning range from 9.11 to 9.55 GHz with the varactor's voltage from 4 to 6 V, an average output power of 3.3 dBm, and an average efficiency of 7% at a gate bias of -3 V and a drain bias of 5 V. The measured phase noise is -82 dBc/Hz and -110 dBc/Hz at offsets of 100 kHz and 1 MHz at a varactor's voltage (Vtune) = 5 V. The phase noise is the lowest reported thus far in VCOs made of GaN-based HEMTs. In addition, the VCO also exhibits the minimum second harmonic suppression of 47 dBc. The chip size is 1.2 × 1.05 mm2. [ABSTRACT FROM AUTHOR]

Fabrication and characterization of AlGaN/GaN HEMT inverters and ring oscillators utilizing integrated enhancement/depletion-mode (E/D-mode) AlGaN/GaN HEMTs are presented. The core technique is a CF4 plasma treatment that can effectively convert a D-mode AlGaN/GaN heterostructure to an E-mode heterostructure. A significant advantage of the plasma-treated E-mode HEMTs is that the gate current is reduced in both reverse- and forward-bias regions due to the effectively enhanced barrier height induced by the negatively charged fluorine ions in the AlGaN barrier. As a result, the input voltage swing is expanded by about 1 V for the E-mode HEMT, enabling convenient input/output logic level matching for multistage logic circuits such as ring oscillators. The fabricated 17-stage direct-coupled field-effect transistor logic ring oscillator using the 1-μm-gate technology can operate properly at a larger supply voltage of 3.5 V, and a minimum propagation delay of 130 ps/stage is achieved. [ABSTRACT FROM AUTHOR]

This paper presents a method with an accurate control of threshold voltages (Vth) of AlGaN/GaN high-electron mobility transistors (HEMTs) using a fluoride-based plasma treatment. Using this method, the Vth of AlGaN/GaN HEMTs can be continuously shifted from 4 V in a conventional depletion-mode (D-mode) AlGaN/GaN HEMT to 0.9 V in an enhancement-mode AlGaN/GaN HEMT. It was found that the plasma-induced damages result in a mobility degradation of two-dimensional electron gas. The damages can be repaired and the mobility can be recovered by a post-gate annealing step at 400 °C. At the same time, the shift in Vth shows a good thermal stability and is not affected by the post-gate annealing. The enhancement-mode HEMTs show a performance (transconductance, cutoff frequencies) comparable to the D-mode HEMTs. Experimental results confirm that the threshold-voltage shift originates from the incorporation of F ions in the AlGaN barrier. In addition, the fluoride-based plasma treatment was also found to be effective in lowering the gate-leakage current, in both forward and reverse bias regions. A physical model of the threshold voltage is proposed to explain the effects of the fluoride-based plasma treatment on AlGaN/GaN HEMTs. [ABSTRACT FROM AUTHOR]

Abstract: A method for fabricating suspended gallium nitride (GaN) structures for microelectromechanical systems (MEMS) without direct etching of GaN is demonstrated. The process combines a selective area growth of GaN-on-patterned-silicon-substrate (GPS) and a subsequent sacrificial wet etching of the silicon under the GaN structures. Both anisotropic and isotropic wet etching techniques are used to carry out the sacrificial etching. The experimental results show that the GPS–MEMS technique can be used to batch-fabricate various GaN-based MEMS devices with common silicon micromachining equipments. [Copyright &y& Elsevier]

This paper presents detailed characterization of a category of edge-suspended coplanar waveguides that were fabricated on low-resistivity silicon substrates using improved CMOS-compatible micromachining techniques. The edge-suspended structure is proposed to provide reduced substrate loss and strong mechanical support at the same time. It is revealed that, at radio or microwave frequencies, the electromagnetic waves are highly concentrated along the edges of the signal line. Removing the silicon underneath the edges of the signal line, along with the silicon between the signal and ground lines, can effectively reduce the substrate coupling and loss. The edge-suspended structure has been implemented by a combination of deep reactive ion etching and anisotropic wet etching. Compared to the conventional silicon-based coplanar waveguides, which show an insertion loss of 2.5dB/mm, the loss of edge-suspended coplanar waveguides with the same dimensions is reduced to as low as 0.5 dB/mm and a much reduced attenuation per wavelength (dB/λg) at 39 GHz. Most importantly, the edge-suspended coplanar waveguides feature strong mechanical support provided by the silicon remaining underneath the center of the signal line. The performance of the coplanar waveguides is evaluated by high-frequency measurement and full-wave electromagnetic (EM) simulation. In addition, the resistance, inductance, conductance, capacitance (RLGC) line parameters and the propagation constant of the coplanar waveguides (CPWs) were extracted and analyzed. [ABSTRACT FROM AUTHOR]

High-performance enhancement-mode AIGaN/GaN HEMTs (E-HEMTs) were demonstrated with samples grown on a low-cost silicon substrate for the first time. The fabrication process is based on a fluoride-based plasma treatment of the gate region and postgate annealing at 450 °C. The fabricated E-HEMTs have nearly the same peak transconductance (Gm) and cutoff frequencies as the conventional depletion-mode HEMTs fabricated on the same wafer, suggesting little mobility degradation caused by the plasma treatment. [ABSTRACT FROM AUTHOR]

A novel Horizontal Current Bipolar Transistor (HCBT) is processed with the scaled down dimensions and the improved technology. The active transistor region is built in the defect-free sidewall of the 580 nm wide n-hills in the (1 1 0) wafer, implying the reduction of the parasitic region''s volume, i.e. the extrinsic base and the collector. The fabricated HCBT exhibits the cutoff frequency (fT) of 21.4 GHz, the maximum frequency of oscillations (fmax) of 32.6 GHz and the collector–emitter breakdown voltage (BVCEO) of 5.6 V, which are the highest fT and the highest fTBVCEO product among the lateral bipolar transistors (LBTs). [Copyright &y& Elsevier]

We report the study of high-dielectric-constant (high-κ) dielectric LaLuO3 (LLO) thin film that is grown on AlGaN/GaN heterostructure by molecular beam deposition (MBD). The physical properties of LLO on AlGaN/GaN heterostrucure have been investigated with atomic force microscopy, x-ray photoelectron spectroscopy, and TEM. It is revealed that the MBD-grown 16 nm-thick LLO film is polycrystalline with a thin (∼2 nm) amorphous transition layer at the LLO/GaN interface. The bandgap of LLO is derived as 5.3 ± 0.04 eV from O1s energy loss spectrum. Capacitance-voltage (C-V) characteristics of a Ni-Au/LLO/III-nitride metal-insulator-semiconductor diode exhibit small frequency dispersion (<2%) and reveal a high effective dielectric constant of ∼28 for the LLO film. The LLO layer is shown to be effective in suppressing the reverse and forward leakage current in the MIS diode. In particular, the MIS diode forward current is reduced by 7 orders of magnitude at a forward bias of 1 V compared to a conventional Ni-Au/III-nitride Schottky diode. [ABSTRACT FROM AUTHOR]

A high electron mobility transistor (HEMT)-compatible power lateral field-effect rectifier (L-FER) with low turn-on voltage is demonstrated using the same fabrication process as that for normally off AlGaN/GaN HEMT, providing a low-cost solution for GaN power integrated circuits. The power rectifier features a Schottky-gate-controlled two-dimensional electron gas channel between the cathode and anode. By tying up the Schottky gate and anode together, the forward turn-on voltage of the rectifier is determined by the threshold voltage of the channel instead of the Schottky barrier. The L-FER with a drift length of 10 μm features a forward turn-on voltage of 0.63 V at a current density of 100 A/cm2. This device also exhibits a reverse breakdown voltage (BV) of 390 V at a current level of 1 mA/mm and a specific on resistance (RON,sp) of 1.4 mΩ cm2, yielding a figure of merit (BV2/RON,sp) of 108 MW/cm2. The excellent device performance, coupled with the lateral device structure and process compatibility with AlGaN/GaN HEMT, make the proposed L-FER a promising candidate for GaN power integrated circuits. [ABSTRACT FROM AUTHOR]

Monolithic integrated 1.9-GHz low noise amplifier (LNA) using 1 μm-gate high-linearity and low noise composite-channel Al0.3Ga0.7N/Al0.05Ga0.95N/GaN HEMT (CC-HEMT) device is designed, fabricated and characterized. The LNA exhibits a noise figure of 1.3 dB, an associated gain of 17 dB, an input return loss of -5.5 dB and an output return loss of -15 dB at 1.9 GHz. The IIP3 and IIP5 of the LNA are 15 and 12 dBm at 1.9 GHz. The LNA with 1 × 100 μm2 device shows high-dynamic range with decent gain and noise figure. © 2007 Wiley Periodicals, Inc. Microwave Opt Technol Lett 49: 1360–1362, 2007; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.22459 [ABSTRACT FROM AUTHOR]

Surface acoustic wave (SAW) devices using two-dimensional electron gas (2DEG) as interdigital transducers (IDTs) on AlGaN/GaN heterostructure has been demonstrated using a planar isolation technique based on the fluoride-based (CF4) plasma treatment technique. The rf characteristics of the SAW filters with planar 2DEG IDTs are compared with SAW devices that are made of metal IDTs or hybrid metal/2DEG IDTs. [ABSTRACT FROM AUTHOR]

Normally-off AlGaN/GaN metal-oxide-semiconductor high electron mobility transistors (MOS-HEMTs) on Si substrate were fabricated with the fluorine-based treatment technique. By employing a 20nmthick Al2O3 gate dielectric deposited by atomic layer deposition, the fabricated MOS-HEMT exhibits a large positive threshold voltage of + 3.5V, a maximum gate input voltage of 15V, a maximum saturate drain current of 5.3A and an off-state breakdown voltage of 402V. The high threshold voltage and the large input voltage swing is expected to improve the electromagnetic interference immunity and safety of AlGaN/GaN MOS-HEMT power switches. [ABSTRACT FROM AUTHOR]

Normally‐off AlGaN/GaN metal‐oxide‐semiconductor high electron mobility transistors (MOS‐HEMTs) on Si substrate were fabricated with the fluorine‐based treatment technique. By employing a 20nm‐thick Al2O3 gate dielectric deposited by atomic layer deposition, the fabricated MOS‐HEMT exhibits a large positive threshold voltage of + 3.5V, a maximum gate input voltage of 15V, a maximum saturate drain current of 5.3A and an off‐state breakdown voltage of 402V. The high threshold voltage and the large input voltage swing is expected to improve the electromagnetic interference immunity and safety of AlGaN/GaN MOS‐HEMT power switches. [ABSTRACT FROM AUTHOR]

III‐nitride optoelectronic and electronic devices have been essentially developed using different epi‐structures, i.e., ‘vertical’ pn junction and ‘lateral’ p‐doping‐free heterojunction, respectively. Integration of the photonic and electronic functionalities of III‐nitride semiconductors is of technological interest but has been challenged by the incompatibility of optimized epi‐growth conditions and by the complexity of integrated devices with different active layers. Baikui Li et al. (pp. 1213–1221) have achieved electroluminescence (EL) including the GaN band‐edge emission at 3.4 eV from Ni/Au‐ AlGaN/GaN p‐doping‐free Schottky‐on‐heterojunction diodes with forward biases higher than 2 V. Based on the surface states distribution of AlGaN, a hot‐electron‐induced surface states impact ionization model was proposed to explain the hole generation and EL process in the p‐doping‐free Schottkyon‐ heterojunction light‐emitting diodes (SoH‐LEDs). This SoH‐LED can be seamlessly integrated into the AlGaN/GaN power high electron mobility transistors (HEMTs) platform as a unique on‐chip photon source. By integrating the SoH‐LED structure into the drain terminal of a HEMT, a transistor with photonicohmic drain (PODFET) is implemented. In PODFET, photon generation is inherently switched ON/OFF in synchronization with the channel current. The dynamic performances of the PODFET are significantly enhanced owing to photon pumping of deep electron traps. [ABSTRACT FROM AUTHOR]