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In this paper, we propose a novel static random access memory (SRAM) unit cell design and its array structure consisting of single-gated feedback field-effect transistors (FBFETs). To verify the SRAM characteristics, the basic memory operations and write disturbances of the unit cell are investigated through the mixed-mode technology computer-aided design simulations. The unit cell exhibits the superior SRAM characteristics including a write speed of 0.6 ns, a fast read-out speed of ~0.1 ns, and a retention time of 3600 s. Furthermore, the unit cell design exhibits advantages in density, with a small cell area of 8F2, and in the power consumption; the standby power consumption is 0.24 nW/bit for holding “1” and negligible for holding “0.” Moreover, our SRAM array shows reliable ${3} \times {3}$ array operations without any disturbances. This paper demonstrates the promising potential of the FBFET SRAM for high-performance, high-density, and low-power memory applications. [ABSTRACT FROM AUTHOR]

In this paper, the transition rate (TR) from the high-resistance state to the low-resistance state of a HfO2-based resistive random access memory (RRAM) is investigated. The TR is statistically characterized by applying constant voltage stresses in the range from 0.45 to 0.65 V. It is found that TR follows a voltage dependence which closely resembles the one exhibited by metal-insulator-semiconductor / metal-insulator-metal structures when subjected to constant voltage stress, but with remarkably different fitting parameters. This result suggests a common underlying mechanism in both evolutionary behaviors. Furthermore, the investigation provides additional evidence supporting the micro-structural changes in the oxide after the forming step as well as the role played by the atomic species during the SET event. [ABSTRACT FROM AUTHOR]

This paper reports on the design optimization of double gate (DG) tunnel FET (TFET) for dynamic memory applications in sub-100-nm regime. It is shown that incorporation of lateral spacing ( L_ \text gap) between the gates, and an underlap region ( L\text {un}) between drain and back gate reduces state “0” degradation, which along with optimal biases, results in an improved Retention Time (RT) at 85 °C. The systematic design optimization increases RT from ~80 to ~300 ms with the use of L\text {gap} at 85 °C, which can be further improved to ~600 ms with the introduction of L\text {un} . The careful investigation shows the back gate scaled down to 25 nm with a front gate region of 100 nm, and operation even at elevated temperatures (125 °C). The insights into DG TFET DRAM operation in terms of individual as well as total lengths highlights the RT enhancement by a factor of 3 with constant total length (200 nm) and an improved scalability with total length scaled down to 160 nm. This paper provides new opportunities to realize TFET-based DRAM with improved RT, scalability, and high temperature operation. [ABSTRACT FROM PUBLISHER]

In Part I, we proposed reconfigurable ferroelectric transistors (R-FEFETs) with a unique property of dynamic modulation between the volatile (logic) and nonvolatile (memory) modes of operation with the help of a control signal. They showcase excellent robustness in the presence of gate leakage with larger hysteresis in the nonvolatile mode with respect to ferroelectric FETs (FEFETs) and higher ON current in the volatile mode compared with standard FETs. Using the unique attributes of R-FEFETs presented in Part I, we explain the dynamics of transition between various modes of operation for circuit-level applications in this paper. We propose a 3T nonvolatile memory design that offers significant power savings over FEFET-based memories by virtue of the control terminal. Our analysis shows that the proposed R-FEFET memory exhibits 55% lower write power and 37%–72% lower read power at iso access time and 33% lower area compared with a recently proposed standard FEFET-based memory. [ABSTRACT FROM AUTHOR]

Recently, exploiting emerging nonvolatile memories to implement the process-in-memory (PIM) paradigm have shown great potential to address the von Neumann bottleneck and have attracted extensive research and development. In this paper, we present a novel PIM platform—spintronic processing unit (SPU), within spin transfer toque magnetic random access memory (STT-MRAM). This energy-efficient and reconfigurable PIM platform can perform different tasks—data storage and logic computing—using the same physical fabric that is programmable at the finest grain, i.e., the individual memory cell level, without the need to move data outside the memory fabric. The proposed SPU works just like a typical memory and all the logic functions are achieved through regularmemory-like write and read operations with minimal modifications. The functionality and performance are evaluated via hybrid circuit simulations under the 40-nm process technology node. Our proposed SPU is expected to be a feasible PIM platform in the near future, owing to the increasing maturity of STT-MRAM. [ABSTRACT FROM AUTHOR]

From its conceptual inception in 2015, the combined capabilities of the multiple-state electrostatically formed nanowire transistor (MSET) have given way to a unique set of logic structures—in the example of NAND and NOR gates—which utilize fewer transistors as compared to conventional technologies. In this paper, we expand the recently published framework of MSET logic functions and present a static random access memory (SRAM) memory structure that consists entirely of MSET devices. Using TCAD simulations, we demonstrate the MSET-SRAM functionality in several phases of operation, while analyzing its performance in terms of speed, stability, and power consumption. [ABSTRACT FROM AUTHOR]

This paper reports on the usefulness of shell-doped (SD) junctionless (JL) transistor architecture for operation as capacitorless dynamic random-access memory (1T-DRAM). SD topology overcomes the problem associated with shallower potential depth in heavily doped devices, thereby enhancing the retention time (RT) along with improved scalability. The use of a thinner shell for achieving high RT is beneficial as it reduces generation and recombination of holes. The results show that an undoped core region with shell thickness (${T}_{\textsf {Shell}}$) of 2 nm yields maximum retention. An SD (${N}_{\mathrm {d}}$) of $10^{18}$ cm $^{-\textsf {3}}$ attains RT of ~5.5 s and ~630 ms at 27 °C and 85 °C, respectively, whereas higher ${N}_{\textsf {d}}$ ($10^{19}$ cm $^{-\textsf {3}}$ shows RT of ~13ms at 85 °C for ${L}_{\textsf {g}} = \textsf {200}$ nm. SD JL transistor shows less degradation in RT with temperature. A 10 nm SD JL device with RT of ~11 ms at 85 °C demonstrates applicability as 1T-DRAM at shorter gate lengths. [ABSTRACT FROM AUTHOR]

A recently reported zero impact ionization and zero subthreshold swing device Z2FET is a promising candidate for capacitor-less dynamic random access memory (DRAM) memory cell. In the memory operation, data retention time determines refresh frequency and is one of the most important memory merits. In this paper, we have systematically investigated the Z2FET retention time based on a newly proposed characterization methodology. It is found that the degradation of HOLD “0” retention time originates from the gated-silicon on insulator (SOI) portion rather than the intrinsic-SOI region of the Z2FET. Electrons accumulate under front gate and finally collapse the potential barrier turning logic “0”–“1.” It appears that Shockley–Read–Hall (SRH) generation is the main source for electrons accumulation. Z2FET scalability has been investigated in terms of retention time. As the Z2FET is downscaled, the mechanism dominating electrons accumulation switches from SRH to parasitic injection of electrons from the cathode. The results show that the downscaling of Lg has little effect on data “0” retention, but Lin is limited to ~125 nm. An optimization method of the fabrication process is proposed based on this new understanding, and Lin can be further scaled down to 75 nm. We have demonstrated by 2-D TCAD simulation that Z2FET is a promising DRAM cells’ candidate particularly for Internet-of-Things applications. [ABSTRACT FROM AUTHOR]

In this paper, we use an automated tool flow in a 14 nm CMOS fin-shaped field-effect transistor (FinFET)/ static random access memory (SRAM) simulation-based design-technology cooptimization (DTCO) including both process-induced and intrinsic statistical variabilities. A 22 nm FinFET CMOS technology is used to illustrate the sensitivity to process-induced fin shape variation and to motivate this paper. Predictive Technology Computer Aided Design (TCAD) simulations have been carried out to evaluate the transistor performance ahead of silicon. Draft-diffusion simulations calibrated to the ensemble Monte Carlo simulation results are used to explore the process and the statistical variability space. This has been enabled by the automation of the tool flow and the dataset handling. The interplay between the process and the statistical variability has been examined in details. A two-stage compact model strategy is used to capture the interplay between process and statistical variability. To close the DTCO loop, the static noise margin and write noise margin sensitivity to cell design parameters and variability in FinFET-based SRAM designs are studied in details. [ABSTRACT FROM AUTHOR]

This paper reports on the potential benefits of a vertically stacked ${n}$ - and ${p}$ -type junctionless (JL) transistor physically decoupled through an intermediate oxide layer for dynamic memory application. The proposed topology enhances the retention time (RT) of capacitorless dynamic random access memory (1T-DRAM), with a significant improvement $(\sim \!\!\times 10^{3})$ compared with a conventional JL transistor with a doping (${N}_{\text{d}}$) of 1019 cm−3. The functionality of architecture as DRAM is based on physically decoupling the conduction region (top ${n}$ -type JL transistor) and storage region (bottom ${p}$ -type JL), while maintaining an electrostatic coupling between them. The charge stored in the ${p}$ -type JL determines RT, and also impacts the read currents, and thus, influences the sense margin of DRAM. Stacked JL (SJL) 1T-DRAM achieves a maximum RT of ~2.5 s for ${N}_{\text{d}} = 5 \times 10^{18}$ cm−3 and ~1 s for 1019 cm−3 with a gate length (${L}_{\text{g}}$) of 200 nm at 85 °C. Results demonstrate its functionality down to 20 nm. The enhanced DRAM metrics (better scalability and high RT) are attributed to optimal architecture due to the vertical stacking of ${n}$ - and ${p}$ -type regions. [ABSTRACT FROM AUTHOR]

In this paper, we demonstrate, for the first time, 3-D Monolithic integration of short-channel replacement metal gate InGaAs n-FinFETs on fully-depleted silicon-on-insulator CMOS, with TiN/W interlayer contacts. Top layer InGaAs nFETs feature raised source-drain and bottom layer CMOS has Si raised source-drain for nFETs, SiGe raised source-drain for pFETS, implants, silicide, and TiN/W plug contacts. Scaled gate length (Lg) of 15 nm is achieved on bottom layer Si n- and pFETs, while the top layer InGaAs n-FinFETs are scaled to Lg of 25 nm. A densely integrated 3-D 6T-static random access memory circuit with planar InGaAs nFETs stacked on Si pFETs is demonstrated by taking advantage of the interlayer contacts. This yields significant area reduction when compared with 2-D layouts. [ABSTRACT FROM AUTHOR]

We present 6T SRAMs with pass-gate feedback using tri-mode independent gate (TMIG) FinFETs as the access transistors. We perform a comprehensive analysis of TMIG FinFETs and the proposed SRAM cell using our simulation framework, which is based on the non-equilibrium Green's function models for FinFETs. We compare our technique with the tied gate (TG) FinFET SRAM and the previously proposed independent gate (IG) FinFET SRAM with pass-gate feedback. The effects of quantum confinement in scaled FinFETs on the device and SRAM characteristics are analyzed in detail. We show that quantum confinement effects lead to severe degradation in access time and write-ability of the IG FinFET SRAM. On the other hand, the SRAM cell proposed in this paper shows 14% improvement in write-ability over the TG FinFET SRAM with comparable read stability, achieving mitigation of the read–write conflict. At the same time, 30% reduction in standby leakage and comparable hold stability is achieved at no cell area penalty, with only 14% increase in the cell access time. We also show that the array-level issues associated with pass-gate feedback are mitigated using the co-design technique presented in this paper. [ABSTRACT FROM PUBLISHER]

It is recognized that the conventional model for metal–ferroelectric–insulator–semiconductor field-effect transistors (MFIS-FETs) always neglects the history-dependent electric field effect of the ferroelectric layer. In this paper, an improved model combining the dipole switching theory with the silicon physics of metal–oxide–semiconductor structures and with Pao and Sah's double integral, respectively, is proposed to describe the capacitance–gate voltage (C –VG) characteristics of MFIS structures and the drain current–gate voltage (ID– VGS) and drain current–drain voltage ( ID–VDS) characteristics of MFIS-FETs. Close agreement between modeling and experimental results confirms the validity of the improved model. The influence of the gate voltage, \SiO2 layer thickness, and interface layer thickness on the C–VG, ID–VGS, and ID–VDS characteristics are simulated and discussed. The memory windows of C–VG and ID–VGS characteristics, as well as the ID –VDS characteristics, increase with increasing gate voltage. The thicker the \SiO2 or interface layer, the worse the transistor characteristics. This paper is expected to provide some guidance to the design and performance improvement of MFIS structure devices. In addition, the mathematical description can be easily combined with electronic design automation software for circuit simulation. [ABSTRACT FROM AUTHOR]

This paper investigates the cell stability of recently introduced four-transistor (4T) and conventional six-transistor (6T) fin-shaped field-effect transistor static random access memory (SRAM) cells operating in a subthreshold region using an efficient model-based approach to consider the impact of device variations. Compared with the 6T cell, this paper indicates that 4T SRAM cells exhibit a better nominal read static noise margin (RSNM) because of the reduced read disturb. For 4T cells, the nearly ideal values of Vwrite, 0 and Vwrite, 1 guarantee the positive nominal write static noise margin (WSNM) for selected cells. For half-selected cells on the selected bit line, a sufficient margin is observed between write time (for selected cells) and write disturb (for half-selected cells). Using the established model-based approach, the variability of subthreshold 6T and 4T SRAM cells is assessed with 1000 samples. Our results indicate that the 4T driverless cell with a larger \mu\RSNM and a slightly worse \sigma\RSNM shows a comparable \mu/\sigma ratio in RSNM with the 6T cell. Furthermore, for a given cell area, 4T SRAM cells using relaxed device dimensions with reduced \sigma\RSNM can outperform the 6T cell. For write operation, 4T SRAM cells exhibit a superior WSNM, whereas the design margin between write time and write disturb needs to be carefully examined to ensure an adequate margin considering device variability. [ABSTRACT FROM PUBLISHER]

This paper analyzes the impacts of intrinsic process variations and negative bias temperature instability (NBTI)/positive BTI (PBTI)-induced time-dependent variations on the stability/variability of 6T FinFET static random access memory (SRAM) cells with various surface orientations and gate dielectrics. Due to quantum confinement, (110)-oriented pull-down n-channel FETs with fin line-edge roughness (LER) show larger Vread,0 and Vtrip variations, thus degrading read static noise margin (RSNM) and its variability. Pull-up p-channel FETs with fin LER that are (100)-oriented show larger Vwrite,0 and Vtrip variations, hence degrade the variability of write SNM. The combined effects of intrinsic process variations and NBTI/PBTI-induced statistical variations have been examined to optimize the FinFET SRAM cells. Worst-case stress scenario for SNM stability/variability is analyzed. With the presence of both NBTI and PBTI in high-k metal-gate FinFET SRAM, the RSNM suffers significant degradation as Vread,0 increases, whereas Vtrip simultaneously decreases. Variability comparisons for FinFET SRAM cells with different gate stacks (\SiO2 and \SiO2/\HfO2) are also examined. Our paper indicates that the consideration of NBTI/PBTI-induced temporal variation changes the optimal choice of FinFET SRAM cell surface orientations in terms of the \mu/\sigma ratio in RSNM. [ABSTRACT FROM PUBLISHER]

Sub-10-nm gate length devices are expected to have severe short channel effects along with new leakage mechanisms, such as direct source-to-drain tunneling (DSDT). In this paper, in order to improve the leakage and to obtain the highest performance/stability in such deeply scaled devices, we perform device–circuit cosimulation for sub-10-nm gate length to optimize devices for logic and memory. For that purpose, double-gate MOSFETs with sub-10-nm gate length are optimized using symmetric/asymmetric gate-to-source/drain underlaps to improve the ON-state current to the OFF-state current ratio and the intrinsic gate delay. Using resulting device characteristics, the effectiveness of supply gating to improve standby leakage in the circuits is studied. We show that supply gating is effective in reducing DSDT current, as well as thermionic leakage current. Also, various SRAM designs are explored to improve stability and leakage in sub-10-nm gate length bit-cells. The analysis shows that 6T SRAM bit-cells with asymmetrically underlapped devices can provide improvement in read stability over symmetric 6T bit-cells, as well as traditional 6T bit-cells. However, the need for higher stability in the sub-10-nm gate length regime due to parameter variation would require us to investigate other bit-cell configurations. Our analysis on 1R/1W differential 8T SRAM bit-cells show that significant increase in read/write stability as well as improvement in write time, and leakage can be achieved compared with the optimized 6T SRAM bit-cells. [ABSTRACT FROM PUBLISHER]

Resistive switching memory (RRAM) has been proposed as an artificial synapse in neuromorphic circuits due to its tunable resistance, low power operation, and scalability. For the development of high-density neuromorphic circuits, it is essential to validate the state-of-the-art bistable RRAM and to introduce small-area building blocks serving as artificial synapses. This paper introduces a new synaptic circuit consisting of a one-transistor/one-resistor structure, where the resistive element is a HfO2 RRAM with bipolar switching. The spike-timing-dependent plasticity is demonstrated in both the deterministic and stochastic regimes of the RRAM. Finally, a fully connected neuromorphic network is simulated showing online unsupervised pattern learning and recognition for various voltages of the POST spike. The results support bistable RRAM for high-performance artificial synapses in neuromorphic circuits. [ABSTRACT FROM AUTHOR]

A 6T SRAM design at a sub-10-nm node calls for carefully designed transistors so that new leakage mechanisms, such as direct source-to-drain tunneling (DSDT) and short channel effects that lead to I\mathrm{\scriptscriptstyle ON}/I\mathrm{\scriptscriptstyle OFF} degradation, are kept under control. In this paper, we explore asymmetric underlap for mitigating DSDT, thermionic leakage, and for improving I\mathrm{\scriptscriptstyle ON}/I\mathrm{\scriptscriptstyle OFF} of double-gate FinFETs. We demonstrate that for 6T SRAMs, asymmetric underlapped n-FinFETs are superior to symmetric underlap/overlap in improving access time and leakage power. We model the atomistic nature of sub-10-nm FinFET channels, quantum confinement, subband nonparabolicity, and anisotropy latent at such length scales using quantum physics-based simulators instead of the conventional semiclassical, drift-diffusion-based Technology Computer Aided Design tools. Using a device/circuit/system-level codesign approach consisting of NEMO5 quantum mechanical device simulations, HSPICE circuit simulations of a 6T SRAM bit cell, and a system-level analysis of a 8-kB L1 and 4-MB L2 cache, we show that the adoption of optimized asymmetric underlapped n-FinFETs can offer up to 6.5% improvement in L1 cache access times and a 2.3-mW reduction in L2 cache leakage power, while delivering noise margins close to symmetric underlapped n-FinFET-based caches. [ABSTRACT FROM PUBLISHER]

Owing to the scaling demands, source/drain (S/D) junction engineering has evolved as a promising technique to improve the performance and reliability of NAND flash memory devices. In this paper, we investigate the impact of S/D doping lateral straggle \sigma L on the program characteristics, data retention, and short-channel effects (SCEs) for sub-25-nm NAND flash memory device. Here, we consider threshold voltage roll-off, subthreshold slope, and drain-induced barrier lowering parameters to study the SCE for the aforementioned memory device. We also examine the effect of varying \sigma L on the junction boost leakage current [during the program-inhibition (P-I) mode] for the considered device. Based on our investigations, we have shown that adjusting the S/D doping lateral straggle \sigma L appropriately not only improves SCE but also the program speed and data retention without any need of altering the gate oxide stack. Furthermore, the junction boost leakage current also decreases on reducing \sigma L . Consequently, it enables the device to hold high channel potential during the P-I mode, and thereby reduces the risk of false programming/erasing of the device. [ABSTRACT FROM AUTHOR]

In this paper, we present an intensive study of 6T-SRAM designs for vertical gate-all-around (GAA) transistors (VFETs) and lateral GAA transistors (LFETs) using 5-nm node design rules. Optimizations of the nanowire (NW) diameter and the gate length are also conducted to enhance the SRAM performance. Device VT retargeting has been proposed for improving the minimum operating voltage ( V\min ) of SRAMs. The isoperformance and isoyield have been performed to assess and determine the benefits provided by LFET and VFET architectures, respectively. Our results show that the VFET bitcells are denser than the LFET bitcells by 20%–30%. The SRAM read stability (read static noise margin) is significantly improved using the NW channel. For a $6\sigma $ yield target and an isoarea of SRAM bitcells, V\min of the VFET bitcell is 80 mV lower than LFET designs. Applying the proposed VT retargeting technique can allow the VFET 122 bitcell to operate at 0.57 V without using assist circuits. A standby leakage below 10 pA/cell can be achieved for both architectures. At isoperformance, the standby leakage of VFET bitcells is $2.6\times $ lower than LFET bitcells. [ABSTRACT FROM AUTHOR]

This paper presents a one-transistor dynamic random access memory (1T-DRAM) based on a novel surrounding-gate transistor with wide trenched body (WT-SGT). This 1T-DRAM exhibits favorable transient performance after word line (WL)/bit line (BL) disturbance, which is verified using Sentaurus TCAD 12.0. The proposed memory cell can be fabricated with a feature area of 4 \mathrmF^2 and with processes that are fully compatible with conventional CMOS technology. Extended simulations reveal three key findings. First, the WT-SGT achieves a high-speed programming operation (1.17 ns) at a low operating voltage (1.6 V) and with a programming window that can be further extended by widening its trenched body. Second, the recombination rate is also reduced, thereby yielding an acceptable retention time (RT) of 625.6 ms. Third, the decreased RT after a 100-ns WL/BL disturbance is improved by 33%, as compared with a conventional SGT 1T-DRAM. We, therefore, believe that this new device will become a competitive candidate for use in future DRAM cells. [ABSTRACT FROM PUBLISHER]

In this paper, a low-cost and low-leakage gate-first high- \(k\) metal-gate CMOS integration compatible with the high thermal budget used in a 2× node dynamic random access memory process flow is reported. The metal inserted polysilicon stack is based on HfO2 coupled with Al2O3 capping for pMOS devices, and with a TiN/Mg/TiN stack together with As ion implantation for nMOS. It is demonstrated that n and pMOS performance of 400 and 200 \(\mu \) A/ \(\mu \) m can be obtained for an OFF-state current of \(10^{-10}\) A/ \(\mu \) m, while maintaining gate and junction leakages compatible with low-power applications. Reliability and matching properties are aligned with logic gate-stacks, and the proposed solution is outperforming the La-cap-based solutions in terms of thermal stability. [ABSTRACT FROM AUTHOR]

In this paper, we illustrate how high-resolution 2-D carrier profiles from scanning spreading resistance microscopy (SSRM) can be used to predict and understand device performance of dynamic random access memory peripheral transistors with high-k metal gate and ultrashallow junctions. In an earlier study on high-speed complementary metal–oxide–semiconductor logic, the 2-D carrier profiles from SSRM were used as the active 2-D dopant profile input to the device simulator as they are virtually identical. The extensive mobile carrier diffusion caused by the lower concentrations, however, implies a strong difference between the mobile carrier distribution and the dopant distribution such that the same approach is no longer valid. Ideally one would have to generate, based on the carrier profiles, the active dopant distribution through the inverse solution of the Poisson equation (in two dimensions) which is, however, numerically nontrivial and often leads to nonunique results. Therefore, an alternative approach is proposed here, whereby we fine-tune the process simulations such that the resulting simulated carrier profiles match the 2-D SSRM profiles. Upon reaching satisfactory agreement, the simulated profiles can be used as input for a device simulator and be used to predict sensitive device parameters such as drain-induced barrier lowering and threshold voltage rolloff. [ABSTRACT FROM AUTHOR]

Underlap FinFET devices, or trigate transistors, are considered to be the most favorable substitute to the conventional bulk device below 22-nm technology node. However, their application in circuit design requires specific attention because of the fin width quantization and increased parasitic. This paper proposes a double dielectric or dual-k spacers technology to enhance the electrostatic integrity of underlap FinFETs. For the first time, we investigate the circuit performance such as that of static RAMs (SRAMs), based on the proposed dual-k spacer FinFETs. The proposed structure enhances SRAMs performance in terms of robustness, access times, and the leakage power during all possible modes of operation. The hold, read, and write-margin increases by 8.7%, 9.4%, and 10.4%, respectively, as compared with conventional FinFET SRAM. Furthermore, the read and write access times reduces by 56% and 17.1%, respectively. Moreover, the standby leakage power is also reduced by \sim73\% compared with the conventional FinFET-based SRAM while occupying same bit-cell area. [ABSTRACT FROM PUBLISHER]

In this paper, we show performance and reliability improvement of Ag-GeS2-based conductive bridge RAM (CBRAM) devices by addition of a 2-nm-thick HfO2 layer between the electrolyte and the W bottom electrode. Our optimized dual-layer electrolyte stack (2-nm HfO2\--30\-nm~GeS2) leads to a resistance ratio (ROFF/RON) higher than 10^6 and projected 10 years read disturb immunity at 0.04 V. The improved memory resistance ratio is explained by means of physical modeling. Using compact modeling and circuit level simulations, we show that our optimized CBRAM device, integrated in a 1T-2R architecture, fits well with the aggressive requirements of field programmable gate array-type reconfigurable applications. Nonvolatility, back-end-of-line compatibility, and 1.3-nA leakage current during continuous reverse read operation at 1 V are strong benefits demonstrated on our device for such applications. [ABSTRACT FROM AUTHOR]

This paper presents a physical model for program and retention transients in ferroelectric (FE) and charge hybrid nonvolatile memory. A region-by-region statistical model for domain switching in polycrystalline FEs was incorporated with the tunneling current simulations to predict the memory window (\Delta VTH) evolution during program and retention operations. The simulations validated the two-step program mechanism experimentally observed in such memories: rapid initial domain switching on account of high fields in the FE layer followed by field enhancement in the tunneling dielectric which initiates electron injection into the storage nodes. Further, these simulations were shown to accurately account for individual \Delta VTH from the two additive memory mechanisms at all program times. The depolarization effect was shown to be dominant for \Delta VTH loss at short and moderate retention time scales (<100~s). This model was further used to provide realistic estimates in achieving dual speed program and the corresponding dual mode retention characteristics akin to a DRAM and flash hybrid operation. [ABSTRACT FROM AUTHOR]

This paper proposes a new asymmetric underlap Fin-Field Effect Transistor (FinFET) structure using a dual-k spacer. Asymmetric dual-spacer at source shows excellent gate control over the channel due to increase in the outer fringe field at gate/source underlap. Hence, this structure exhibits a superior short-channel effect metric over the conventional/single-spacer underlap FinFET. The proposed asymmetric structure enhances static random access memories (SRAMs) performance in terms of robustness, access times as well as leakage power during the hold, read, and write operations. The hold static noise margin and write margin increases by 5.16% and 5.66%, respectively. The read stability enhances by 13.75% and 19.35% over conventional FinFET SRAM circuit. Furthermore, the leakage power reduces by 60%, and write access time improves by 23.63%. Compared with conventional FinFET-based SRAM, same bit-cell area and read delay are associated with the proposed structure. Supply voltage scalability on SRAM design metrics is also investigated. In addition to SRAM application, underlap length, lateral source/drain doping gradient, and the high-k spacer width are optimized for high-performance digital applications. [ABSTRACT FROM AUTHOR]

A novel one transistor and one diode (1T-1D) dynamic random access memory cell for embedded applications is proposed. This memory cell consists of a floating-gate (FG) MOSFET and a gated diode. The anode of the diode is connected to the FG, so that the threshold voltage of the FG MOSFET can be modulated by the current through the diode. In this paper, basic device operations, speed, retention, and disturb performance are investigated using Silvaco technology computer-aided design simulation tools. The process compatibility is also investigated by integrating the memory array and specific sense amplifier. [ABSTRACT FROM PUBLISHER]

In this paper, we propose \Al/SiO2/\Dy2\O3/ \SiO2/ \Si, \Al/SiO2/\DyTix \Oy/\SiO2/\Si, and \Al/Al2 \O3/\DyTix\Oy/\SiO2/\Si as charge-trapping memory devices incorporating high-k \Dy2\O3 and Ti-doped \Dy2 \O3 films as charge-trapping layers, and \SiO2 and \Al2\O3 films as blocking layers. The \Al/Al2\O3/\DyTix \Oy/\break \SiO2/\Si memory device exhibited a larger memory window of \sim4.5 V (measured at a sweep voltage range of \pm9 V), a smaller charge loss of \sim20% (measured time up to \10^6\ \s and at 85 ^\circ\C), and better endurance (program/erase cycles up to \10^4) than other devices. These results suggest higher probability for trapping the charge carrier due to the Ti content in the \Dy2\O3 film, which produce a high dielectric constant and suppress the formation of the Dy-silicate layer, and create a deep trap level in the \DyTix\Oy film. [ABSTRACT FROM PUBLISHER]

In this paper, we present tri-mode independent-gate (IG) FinFETs for dynamic voltage/frequency scalable 6T SRAMs. The proposed design exploits the fact that the spacer patterning technology, used for FinFET fabrication, offers the same device footprint for two- and one-fin transistors. The access transistor is designed for operation in three on-state modes achieving simultaneous increase in the read stability and write-ability and enabling appropriate tradeoffs between read stability and access time depending on the frequency requirements. The proposed design achieves 40%–48% higher weak-write test voltage and 2%–34% lower cell write time across a range of voltages compared with a conventional FinFET-based 6T SRAM under iso-leakage. During the read operation at high workload conditions (VDD = \0.7\ \V), 8% improvement in read static noise margin (SNM) is achieved with only 7% access time penalty. During the read operation at low workload conditions, 54%–75% improvement in the read SNM enables low voltage operation under process variations. The proposed IG FinFET SRAM achieves 125–136 mV lower VMIN across different global process corners at the cost of 15-mV higher retention VMIN. Iso-leakage comparison of the proposed technique with the previously proposed IG FinFET 6T SRAM is also performed. An increase in the cell area by 35% is observed compared to the minimum-sized conventional FinFET SRAM. However, there is no cell area penalty compared to the previously proposed IG FinFET SRAM. [ABSTRACT FROM PUBLISHER]

In this paper, we report monolithic integration of two single-grain silicon layers for static random access memory (SRAM) and image sensor applications. A 12 \times 28 silicon lateral photodiode array with a 25-\mu\m pixel size prepared on top of a three-transistor readout circuit with individual outputs for every pixel is demonstrated. 6T SRAM cells with two layers of stacked transistors were prepared to compare the performance and area of each cell in different configurations. [ABSTRACT FROM PUBLISHER]

For more than 45 years, photon- and electron-sensitive materials have been used to produce pattern-transfer masks in the lithographic manufacturing of integrated circuits. With the semiconductor technology feature size continuing to shrink and the requirements of low-variability and low-cost manufacturing, optical lithography is driven to its limits. In this paper, we report a novel nanoinjection lithography (NInL) technique that employs electron-beam-assisted deposition to form pattern-transfer hard mask in a direct-write deposit approach. By scanning the 4.6-nm-diameter electron beam while injecting a suitable organometallic precursor gas around the location of e-beam and just above the substrate, we form a high-density (pitch: 40 nm) high-uniformity (3-sigma linewidth roughness: 2 nm) hard mask for subsequent etching without using proximity-effect correction techniques. Furthermore, this technique can also directly deposit a metal pattern for interconnect or a dielectric pattern without the need for separate metal or dielectric deposition, photoresist etch-mask, and etching processes. The NInL approach simplifies the hard-mask creation or even metal or dielectric pattern creation process modules from five or tens of steps to only a single step. Therefore, it saves both photomask making and wafer processing costs. In addition, room-temperature NInL deposition of conductor/dielectric materials enables the fabrication of small versatile devices and circuits. For demonstration, we fabricated a functional 16-nm six-transistor static random access memory (SRAM) cell (area: occupying only 0.039 \mu\m^2), 43% the size of the smallest previously reported SRAM cell, using the FinFET structure and a dynamic \Vdd regulator approach. The NInL technique offers a new way of exploring low-volume high-value 16-nm complementary metal–oxide–semiconductor (CMOS) devices and circuit designs with minimal additional investment and obtains early access to extreme CMOS scaling. [ABSTRACT FROM PUBLISHER]

In this paper, the application of an asymmetric independent-gate MOSFET (IG-MOSFET) to the bit-cell structures of the SRAM schemes that were previously proposed using the symmetric IG-MOSFET is analyzed. In addition, a novel SRAM scheme with the asymmetric IG-MOSFET is proposed to improve read stability and writeability by controlling the back gates of pass-gate and pull-up transistors. New array architecture is also suggested to prevent read stability degradation in the half-selected cell, where word line is selected but bit line is unselected. The previous SRAMs with IG-MOSFET (IG-SRAMs) fail to simultaneously improve read stability and writeability compared to the SRAM with the tied-gate MOSFET. The proposed IG-SRAM significantly improves both read stability and writeability at the cost of slightly increased bit-cell area and read delay, as compared to the previous IG-SRAMs. [ABSTRACT FROM PUBLISHER]

In this paper, an in-depth variability analysis, i.e., from the threshold voltage VT of metal–oxide–semiconductor field-effect-transistors (MOSFETs) to the static noise margin (SNM) of static random-access memory (SRAM) cells, is presented in fully depleted silicon-on-insulator (FDSOI) technology. The local VT variability \sigmaVT lower than AVT = \1.4\ \mV\cdot\mu\m is demonstrated. We investigated how this good VT variability is reported on the SNM fluctuations \sigmaSNM at the SRAM circuit level. It is found experimentally that \sigmaSNM is correlated directly to the \sigmaVT of SRAM transistors without any impact of the mean SNM value. The contributions of the individual MOSFETs in the SRAM cells have been determined quantitatively by using a homemade Simulation Program with Integrated Circuit Emphasis compact model calibrated on our FDSOI electrical characteristics. The VT variability in n-channel MOSFETs (nMOSFETs) is more critical than that in p-channel MOSFETs for SNM fluctuations, and \sigmaVT in drive nMOSFETs is the key parameter to control for minimizing \sigmaSNM. [ABSTRACT FROM PUBLISHER]

This paper identifies and investigates a new source of random threshold voltage variation, which is referred to as Grain-Orientation-induced Quantum Confinement (GOQC) in emerging ultra-thin-body metal-gate complementary metal–oxide–semiconductor (CMOS) devices including FinFET, tri-gate, and nanowire field-effect transistors. Due to the dependence of the work function of the metal gates on their grain orientations, different parts of the gate in multigate CMOS devices can have different work functions, resulting in a high electric field in the channel (body) of these devices and, hence, in electrical confinement of the carriers. GOQC effect is shown to be the dominant source of the quantum threshold voltage variation in all emerging ultra-thin multi-gate devices including FinFETs. It is also highlighted for the first time that such variations can have significant implications for the performance and reliability of minimum-sized digital circuits such as static random-access memory cells. [ABSTRACT FROM AUTHOR]

In this paper, we analyze and optimize FinFETs with asymmetric drain spacer extension (ADSE) that introduces a gate underlap only on the drain side. We present a physics-based discussion of current–voltage relationships, short channel effects, and leakage and show the application of ADSE FinFETs in 6T static random access memory (SRAM) bit cell. By exploiting asymmetry in current, we show that it is possible to achieve improvement in both read and write stability for the 6T SRAM bit cell, along with reduction in cell leakage at the cost of negligible increase in access time and area. We also propose a general circuit-aware device optimization methodology for SRAM design. We use this methodology to optimize the underlap in ADSE FinFETs. Compared to conventional FinFETs, we achieve 57% reduction in leakage, 11% improvement in read static-noise margin, and 6% improvement in write margin, with 7% increase in access time and cell area. [ABSTRACT FROM AUTHOR]

In this paper, the design space, including fin thickness (Tfin), fin height (Hfin), fin ratio of bit-cell transistors, and surface orientation, is researched to optimize the stability, leakage current, array dynamic energy, and read/write delay of the FinFET SRAM under layout area constraints. The simulation results, which consider the variations of both Tfin and threshold voltage (Vth), show that most FinFET SRAM configurations achieve a superior read/write noise margin when compared with planar SRAMs. However, when two fins are used as pass gate transistors (PG) in FinFET SRAMs, enormous array dynamic energy is required due to the increased effective gate and drain capacitance. On the other hand, a FinFET SRAM with a one-fin PG in the (110) plane shows a smaller write noise margin than the planar SRAM. Thus, the one-fin PG in the (100) plane is suitable for FinFET SRAM design. The one-fin PG FinFET SRAM with Tfin = \10\ \nm and Hfin = \40\ \nm in the (100) plane achieves a three times larger noise margin when compared with the planar SRAM and consumes a 17% smaller bit-line toggling array energy at a cost of a 22% larger word-line toggling energy. It also achieves a 2.3 times smaller read delay and a 30% smaller write delay when compared with the planar SRAM. [ABSTRACT FROM PUBLISHER]

This paper presents a new class of charge-trap Flash memory device with resistive switching mechanisms. We propose a fused memory scheme using a structure of metal/\Pr0.7 \Ca0.3\MnO3 (PCMO)/nitride/oxide/silicon to graft fast-switching features of resistive random access memory onto high-density silicon/oxide/nitride/oxide/silicon memory structures. In this scheme, both program and erase (P/E) are performed by the conduction of the carriers that are injected from the gate into the nitride layer through the PCMO, which is a resistive switching material; the resistance state determines whether a program or erase function is performed. In the proposed memory devices, we observed improved memory characteristics, including the current–voltage hysteresis having a resistive ratio exceeding three orders of magnitude at a set voltage of \pm4.5 V, a memory window of 2.3 V, a P/E speed of 100 ns/1 ms, data retention of ten years, and endurance of \10^5 P/E cycles. This approach will offer critical clues about how one can best implement universal features of nonvolatile memories in a single chip. [ABSTRACT FROM PUBLISHER]